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Er-Ping Li

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Electrical modeling and design for 3D integration
Electrical Modeling And Design For 3d System Integration
Plasmonic Nanoelectronics And Sensing
Electrical Modeling and Design for 3D System Integration: 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
Electrical Modeling and Design for 3D System Integration 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
New Advances in Maxwell’s Equations and Applications
New Advances in Maxwell’s Equations and Applications (NanoScience and Technology)
Plasmonic Nanoelectronics and Sensing
Electrical Modeling and Design for 3D System Integration 3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC
Plasmonic Nanoelectronics and Sensing