Michael G. Pecht profile picture

Michael G. Pecht

Is this your author profile? Create an account to customize it!

Stand Alone

Optimum Cooling of Data Centers
Copper Wire Bonding
Optimum Cooling of Data Centers Application of Risk Assessment and Mitigation Techniques
Optimum Cooling of Data Centers
Encapsulation Technologies for Electronic Applications (Materials and Processes for Electronic Applications)
Encapsulation Technologies for Electronic Applications
Reliability Engineering