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P. S. Ho

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Stand Alone

Stress-induced phenomena in metallization
Low dielectric constant materials for IC applications
Electronic packaging materials science VI
Thin films
Stress-induced phenomena in metallization
Stress Induced Phenomena and Reliability in 3D Microelectronics Kyoto, Japan, 28-30 May 2012
Electromigration in Metals Fundamentals to Nano-interconnects
Thin Films - Interfaces and Phenomena: Volume 54
Thin Films - Interfaces and Phenomena: Volume 54