American Society of Mechanical Engineers. Electrical and Electronic Packaging Division profile picture

American Society of Mechanical Engineers. Electrical and Electronic Packaging Division

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Application of Fracture Mechanics in Electronic Packaging and Materials: Presented at the 1995 Asme International Mechanical Engineering Congress and ... Francisco, California (Eep (Series), V. 11.)
Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)
Application of Fracture Mechanics in Electronic Packaging: Presented at the 1997 Asme International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas (Amd Series)