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Michael Pecht

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Guidebook For Managing Silicon Chip Reliability
China's electronics industry
Contamination of electronic assemblies
Electronic packaging materials and their properties
Soldering processes and equipment
Integrated circuit, hybrid, and multichip module package design guidelines
China's Electronics Industry
Guidebook for managing silicon chip reliability
Handbook of Electronic Package Design (Mechanical Engineering (Marcell Dekker))
Parts Selection and Management
Product Maintainability Supportability Handbook
Prognostics and health management of electronics
Engineering for Social Change Revisited Engineering Is Not Just Engineering
Lead-free electronics
Placement and routing of electronic modules

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Michael Pecht — Books & Biography | Menrva Books | MenrvaBooks