Author Description

Semiconductors have become tremendously important in our society. Manufacturing of electronic, optical/optoelectronic devices and micro electro mechanical systems (MEMS) from semiconductor materials has been one of the key areas that support advanced science and technology. The manufacturing of semiconductor products is a very complicated issue which involves a series of mechanical, physical, chemical and hybrid machining processes. For simplicity, we can roughly divide the manufacturing processes into two steps: the fabrication of high quality semiconductor substrates, and the generation of precise micro-nano structures on the substrates. For either step, the understanding of material removal mechanism in machining is essentially important. For this reason, the clarification of the semiconductor machining physics in the micro-nano level and the development of novel machining technologies have attracted intensive interests from industrial engineers and multidisciplinary researchers. The purpose of this book is to provide a forum for researchers and engineers to review recent achievements and new advances in the area of semiconductor machining, and to identify possible research directions in future. This book collects ten chapters devoted to some main aspects, both theoretical and experimental, of Semiconductor Machining. The first part (Chapters 1, 2 and 3) provides fundamental investigation results on ductile machining behaviors of semiconductors by using single-point diamond machining methods. The second part (Chapters 4 and 5) presents characterization results of semiconductor deformation mechanism obtained by indentation, scratching and machining tests and theoretically analysis using molecular dynamics. Part 3 (Chapters 6, 7 and 8) deals with multipoint abrasive machining processes of semiconductors including grinding, polishing and slicing. The last part (Chapters 9 and 10) is focused on the micromachining of semiconductor materials using mechanical-chemical h