Author Description

Process automation: a rheological and chemical overview of thermoset curing / C.A. May, M.R. Dusi, J.S. Fritzen, D.K. Hadad, M.G. Maximovich, K.G. Thrasher, and A. Wereta, Jr. --Cure kinetics and mechanical properties of a resin matrix: effects of impurities and stoichiometry / Gary L. Hagnauer, Peter J. Pearce, Bernard R. Laliberte, and Margaret E. Roylance --Kinetics of acetylene-terminated resin cure and its effects on dynamic mechanical properties / I.J. Goldfarb, C.Y-C. Lee, and C.C. Kuo --Acetylene-terminated resin cures: air and nitrogen effects / C.Y-C. Lee, C.C. Kuo, and I.J. Goldfarb --Mechanism and kinetics of the curing process in a resin system / J. Moacanin, M. Cizmecioglu, S.D. Hong, and A. Gupta --Moisture-temperature effects on the dynamic mechanical properties of epoxy polymers / Wayne J. Mikols and James C. Seferis --Cross-linking reaction of an epoxy resin with phthalic anhydride / Elbert W. Crandall and Winston Mih --Chemiluminescence of thermosetting resins / Clarence J. Wolf, Dale L. Fanter, and Michael A. Grayson --Poly(n-butyl methacrylate) and poly(butyl methacrylate-co-acrylic acid) films: dried from solutions of hydrogen bonding capability / Michael S. Chuu, Carl J. Knauss, Richard J. Ruch, and Raymond R. Myers --Cure of intaglio printing inks / D.L. Hunston, J.L. Rushford, W.R. Newitt, and B.A. Vandreuil --Curing behavior of segmented polyurethane adhesives / D. Mark Hoffman --Rheological cure transformation diagrams for evaluating polymer cure dynamics / Richard J. Hinrichs --Curing kinetics of unsaturated polyester and vinyl ester resins / Chang Dae Han and Kwok-Wai Lem --Dynamic mechanical and dielectric properties of an epoxy resin during cure / W.X. Zukas, W.J. Macknight, and N.S. Schneider --Reactive systems: finite element analysis / Craig Douglas and David Roylance --Kinetic model of cure reactions: aids to property and processing predictions / H.S.-Y. Hsich, R.M. Zurn, and R.J. Ambrose --Thermosetting coatings: analytical