Heat transfer in electronic systems, 1994: Presented at 1994 International Mechanical Engineering Congress and Exposition, Chicago, Illinois, November 6-11, 1994
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Contains papers presented in two technical sessions at the November 1994 congress: Benchmarking Standards for Computational Codes for Electronic Packaging Design, and High Performance Heat Sinks in Electronic Packaging. Topics include large-scale computational simulations, and cooling devices in high heat-dissipation rate applications. Lacks an index. Annotation copyright by Book News, Inc., Portland, OR
Page Count:
153
Publication Date:
1994-01-01
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