CAE - CAD & Thermal Management Issues in Electronic Systems: Proceedings, Asme International Mechanical Engineering Congress & Exposition, Dallas, Tx. 1997 (Eep Htd Series Volumes 23 and 356)
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Author Description
Proceedings of the November 1997 symposium. Twelve papers relate to the use of computer simulations to solve complex packaging problems related to thermo/mechanical problems. Topics include improving electronic packaging manufacturing through product and process-driven analysis; thermo-mechanical an
Page Count:
109
Publication Date:
1997-01-01
ISBN-10:
0791818527
ISBN-13:
9780791818527
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