Reliability, Stress Analysis and Failure Prevention Issues in Adhesive and Bolted Connections: Presented at the 1999 Asme International Mechanical ... Engineers, Design Engineering Division))
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Author Description
Contains the 16 papers presented at the November 1999 symposium. The topics include temperature distribution in a VLSI chip due to dynamic power density, the strength of joints combining adhesives with bolts, optimization of adhesively bonded single lap joints by adhered notching, and estimation of
Page Count:
171
Publication Date:
1999-01-01
ISBN-10:
0791816591
ISBN-13:
9780791816592
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