Istfa 2021 Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis
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Author Description
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
Page Count:
461
Publication Date:
2022-03-30
ISBN-10:
1627084193
ISBN-13:
9781627084192
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