Volume is indexed by Thomson Reuters CPCI-S (WoS). The topics covered herein include: Single-point diamond turning; Ultra-precision grinding technology; High-speed and high-efficiency machining; Machine tools and systems; In-process measurement and monitoring; Metrology and evaluation; Finishing, lapping and polishing; Micro/nano machining and fabrication; Forming processes for optical and electrical components; CMP and silicon-wafer processing; Brittle-material machining; EDM, ultrasonic machining and laser machining; and Related precision machining methods. This work will provide a valuable and fruitful reference source for researchers in the field of ultra-precision machining who wish to understand, in greater depth, the underlying mechanisms and to create new and practical design technologies, systems and processes. It will also be particularly useful to practising engineers who are responsible for providing efficient, precise and effective machining.