Andrew A. O. Tay profile picture

Andrew A. O. Tay

Is this your author profile? Create an account to customize it!

Stand Alone

Proceedings of the 1997 1st Electronic Packaging Technology Conference
Proceedings of 2nd Electronics Packaging Technology Conference
Interconnect and Wafer Bonding Technology
Encyclopedia of Packaging Materials, Processes, and Mechanics Interconnect and wafer bonding technology. Set 1