Author Description

Annotation EPTC '98 provides a forum for package development engineers, scientists & researchers to present their findings & innovations, & to exchange ideas in electronic packaging technology. The organizers aim was to establish EPTC as a major electronic packaging conference in the South East Asian region where the bulk of the world's electronic packaging activities is taking place. Partial Contents: Chip Scale Packaging & its Impact on PCB Substrate Technology; Electrical Design of High Performance Packages; Thermal Management of Electronic Packages & Systems; Flip Chip Technology.